Spc, Molding process equipment, Jmp, Tooling Design and Simulation, IC Packaging Assembly Process Flow, Fmea, 8D, Dmaic

thermal methods TGA, Lean Six Sigma, hardness composition, 3D Optical Microscope, Fmea, Spc, material analysis techniques, Process Engineering, FE-SEM, Doe, Data Analysis, EDS, Dsc, Ftir, structural and morphological SEM, yield improvement, physical PSA-Micro, PSA-Nano, X-ray